PLASMA PARAMETER AND ETCH MEASUREMENTS IN A MULTIPOLAR CONFINED ELECTRON-CYCLOTRON RESONANCE DISCHARGE

被引：19

作者：

MANTEI, TD

RYLE, TE

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1991年 / 9卷 / 01期

关键词：

D O I：

10.1116/1.585786

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A multipolar confined electron cyclotron resonance discharge has been characterized by plasma parameter and etch measurements in Ar and SF6. Positive ion densities of 10(11) cm-3 or greater are obtained at pressures of 0.1-1.0 mTorr with 400-600 W input microwave power. The positive ion current density uniformity across a 16 cm diam is +/- 4% at 1.0 mTorr. Silicon etch rates of 0.25-1.25-mu-m/min are obtained with 0.1-1.0 mTorr of SF6, with -60 V substrate bias.

引用

页码：29 / 33

页数：5

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