CURE KINETICS OF HIGH-PERFORMANCE EPOXY-RESIN SYSTEMS - REACTION WITH HPT CURING AGENT FROM DYNAMIC EXPERIMENT

被引：9

作者：

SHIM, JS ^{[1
]}

LEE, W ^{[1
]}

JANG, JS ^{[1
]}

机构：

[1] KOREA ADV INST SCI & TECHNOL,POLYMER COMPOSTES LAB,SEOUL 131,SOUTH KOREA

来源：

POLYMER BULLETIN | 1991年 / 25卷 / 06期

关键词：

D O I：

10.1007/BF01032663

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

Cure kinetics of epoxy based on EPON HPT 1071 resin with EPON HPT 1062 curing agent were studied by dynamic differential scanning calorimetry experiment. Kinetic parameters were determined as functions of different epoxy formulations and heating rates. Total heat of cure was independent of heating rate, which was increased with decreasing the concentration of curing agent. The extent of cure at peak is nearly constant and independent of heating rate at a given curing agent concentration. Due to the diffusion controlled cure process, the activation energy of hydroxyl-epoxide reaction (peak 2) is higher than that of the primary amine-epoxide reaction (peak 1). The relationship between peak temperature and heating rate has been also undertaken in this study.

引用

页码：669 / 675

页数：7

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