TBGA PACKAGE TECHNOLOGY

TBGA or Tape Ball Grid Array is a ball grid array package which utilizes solder bumps to connect the TAB tape to the printed circuit card or board. The array of outer lead bond (OLB) joints is typically on a 50 mil grid. This technology differs from conventional TAB peripheral OLB in that the package can be ''picked and placed'' using conventional card assembly equipment and processes at very high assembly yields. If thermal enhancement is required, a heatsink can be attached to the die. The technology can be applied to both single and double level metal tape; and can utilize various inner lead bonding (ILB) techniques, i.e., peripheral thermocompression, thermosonic, or wirebonding, and area array solder reflow. This paper describes the package technology, applications, and attributes.