THERMAL MANAGEMENT OF AIR-COOLED AND LIQUID-COOLED MULTICHIP MODULES

被引：49

作者：

BARCOHEN, A ^{[1
]}

机构：

[1] UNIV MINNESOTA,DEPT MECH ENGN,MINNEAPOLIS,MN 55455

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

D O I：

10.1109/TCHMT.1987.1134734

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：159 / 175

页数：17

共 45 条

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OKTAY, S
KAMMERER, HC
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 55 - 66
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[35] OTSUKA K, 1985, MAY IEEE COMP SOC SP
[36] REDDY R, 1985, FEB INT SOL STAT CIR
[37] SAMANT KR, 1986, AIAA THERMOPHYSICS C
[38] TOSHIHIKO W, 1985, 1985 P IEEE EL COMP, P192
[39] TUCKERMAN DB, 1981, IEEE ELECTRON DEVICE, V2
[40] WAGER AJ, 1984, ISHM6984003 TECHN MO, P1