THERMAL MANAGEMENT OF AIR-COOLED AND LIQUID-COOLED MULTICHIP MODULES

被引：49

作者：

BARCOHEN, A ^{[1
]}

机构：

[1] UNIV MINNESOTA,DEPT MECH ENGN,MINNEAPOLIS,MN 55455

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1987年 / 10卷 / 02期

关键词：

D O I：

10.1109/TCHMT.1987.1134734

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：159 / 175

页数：17

共 45 条

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