ENERGETICS AND MODEL SIMULATION OF IMPACT FRACTURE OF BRITTLE SOLIDS

被引:1
作者
SHIMAMURA, S
机构
[1] Department of Applied Science, Faculty of Engineering, Yamaguchi University, Ube
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 1994年 / 176卷 / 1-2期
关键词
D O I
10.1016/0921-5093(94)90991-1
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
A model for crack growth in brittle solids is developed using a cubic lattice system on the basis of release and transfer processes of strain energy. The fracture pattern caused by an impact shock on the surface of brittle solids is explored by means of computer simulations. The simulations show that the pattern of impact cracks and the energy released by impact cracks are dominated by the distribution of strain energy. Morphology and energetics of impact fracture in brittle materials are discussed on the basis of the results of simulations.
引用
收藏
页码:303 / 307
页数:5
相关论文
共 11 条
  • [1] Charmet J. C., 1990, DISORDER FRACTURE
  • [2] GRAHAM RA, 1992, SOLIDS HIGH PRESSURE
  • [3] THERMAL SHOCK-INDUCED FRACTURE OF ION-IMPLANTED LIF CRYSTALS
    GURARIE, VN
    WILLIAMS, JS
    [J]. JOURNAL OF MATERIALS RESEARCH, 1990, 5 (06) : 1257 - 1265
  • [4] Herrmann HJ, 1990, STATISTICAL MODELS F
  • [5] THERMAL-SHOCK BEHAVIOR OF DUPLEX CERAMICS
    LUTZ, EH
    SWAIN, MV
    CLAUSSEN, N
    [J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1991, 74 (01) : 19 - 24
  • [6] SCHMIDT SC, 1992, SHOCK COMPRESSION CO
  • [7] COMPUTER MODELING OF THERMAL SHOCK-INDUCED CRACK-GROWTH IN BRITTLE MATERIALS
    SHIMAMURA, S
    SOTOIKE, Y
    [J]. JOURNAL OF MATERIALS RESEARCH, 1992, 7 (05) : 1286 - 1291
  • [8] CRACK PATTERNS AND STRAIN-ENERGY DISTRIBUTIONS IN MODEL BRITTLE SYSTEMS IN A RANDOM ENVIRONMENT
    SHIMAMURA, S
    KURIYAMA, K
    [J]. JOURNAL OF MATERIALS SCIENCE, 1991, 26 (22) : 6027 - 6034
  • [9] SHIMAMURA S, UNPUB J MATER RES
  • [10] Taiwo MB, 2008, SOLID STATE PHYS, V54, P75, DOI DOI 10.1016/S0081-1947(08)60368-9.HTTP://LINKINGHUB.ELSEVIER.C0M/RETRIEVE/PII/S0081194708603689