ELECTRICAL PERFORMANCE OF HIGH-SPEED INTERCONNECT SYSTEMS

[1] TRANSIENT ANALYSIS OF LOSSLESS COUPLED TRANSMISSION LINES IN A NONHOMOGENEOUS DIELECTRIC MEDIUM [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1970, MT18 (09) : 616 - &

[2] HARRINGTON RF, 1984, IEEE T MICROW THEORY, V32, P705, DOI 10.1109/TMTT.1984.1132757

[3] HORNO M, 1982, P I ELEC ENG H, V129, P89

[4] MEYER CS, 1968, ANAL DESIGN INTEGRAT, P351

[5] APPLICATION OF THE FINITE-ELEMENT METHOD TO DETERMINE THE ELECTRICAL-RESISTANCE, INDUCTANCE, CAPACITANCE PARAMETERS FOR THE CIRCUIT PACKAGE ENVIRONMENT [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04): : 486 - 492

[6] ELECTRICAL MODELING OF INTERCONNECTIONS IN MULTILAYER PACKAGING STRUCTURES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 217 - 223

[7] LOWER AND UPPER BOUND CALCULATIONS ON THE CAPACITANCE OF MULTICONDUCTOR PRINTED TRANSMISSION-LINE USING THE SPECTRAL-DOMAIN APPROACH AND VARIATIONAL METHOD [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1986, 34 (02) : 236 - 244

[8] SCHEINFEIN M, 1987, IN PRESS T SCS MAR

[9] CALCULATION OF COEFFICIENTS OF CAPACITANCE OF MULTICONDUCTOR TRANSMISSION LINES IN PRESENCE OF DIELECTRIC INTERFACE [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1970, MT18 (01) : 35 - +

[10] WEI C, 1984, IEEE T MICROW THEORY, V32, P439

[1] TRANSIENT ANALYSIS OF LOSSLESS COUPLED TRANSMISSION LINES IN A NONHOMOGENEOUS DIELECTRIC MEDIUM [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1970, MT18 (09) : 616 - &

[2] HARRINGTON RF, 1984, IEEE T MICROW THEORY, V32, P705, DOI 10.1109/TMTT.1984.1132757

[3] HORNO M, 1982, P I ELEC ENG H, V129, P89

[4] MEYER CS, 1968, ANAL DESIGN INTEGRAT, P351

[5] APPLICATION OF THE FINITE-ELEMENT METHOD TO DETERMINE THE ELECTRICAL-RESISTANCE, INDUCTANCE, CAPACITANCE PARAMETERS FOR THE CIRCUIT PACKAGE ENVIRONMENT [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1982, 5 (04): : 486 - 492

[6] ELECTRICAL MODELING OF INTERCONNECTIONS IN MULTILAYER PACKAGING STRUCTURES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 217 - 223

[7] LOWER AND UPPER BOUND CALCULATIONS ON THE CAPACITANCE OF MULTICONDUCTOR PRINTED TRANSMISSION-LINE USING THE SPECTRAL-DOMAIN APPROACH AND VARIATIONAL METHOD [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1986, 34 (02) : 236 - 244

[8] SCHEINFEIN M, 1987, IN PRESS T SCS MAR

[9] CALCULATION OF COEFFICIENTS OF CAPACITANCE OF MULTICONDUCTOR TRANSMISSION LINES IN PRESENCE OF DIELECTRIC INTERFACE [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1970, MT18 (01) : 35 - +

[10] WEI C, 1984, IEEE T MICROW THEORY, V32, P439