A STUDY OF LASER-ENHANCED ELECTRODEPOSITION PROCESS OF COPPER

被引：0

作者：

WANG, XH

ZHOU, HJ

YU, ZZ

机构：

来源：

ACTA CHIMICA SINICA | 1993年 / 51卷 / 04期

关键词：

D O I：

暂无

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

Electrodeposition process of copper under a laser beam has been studied by rotating disk electrode. A laser beam results local temperature rise at electrode-solution interface, thi leads to: local positive shift of rest potential, increase in exchange current i0 and charge transfer coefficient alpha, strong microstirring which raises limiting current density. All these changes enhance electrodeposition rates, thus high-speed selective electroplating can be reached.

引用

页码：341 / 345

页数：5

共 5 条

[1]

ANTROPOV L, 1907, THEORETICAL ELECTRON, P194

[2] ON THE MECHANISM OF LASER ENHANCED PLATING OF COPPER [J].