Line Length Effect on Electromigration Characteristics of Eutectic SnPb Solder

被引：1

作者：

Lee, Yong-Duk ^{[1
]}

Lee, Jang-Hee ^{[1
]}

Yoon, Min-Seung ^{[2
]}

Joo, Young-Chang ^{[2
]}

Park, Young-Bae ^{[1
]}

机构：

[1] Andong Natl Univ, Sch Mat Sci & Engn, Andong 760749, South Korea

[2] Seoul Natl Univ, Sch Mat Sci & Engn, Seoul 151742, South Korea

来源：

KOREAN JOURNAL OF MATERIALS RESEARCH | 2007年 / 17卷 / 07期

关键词：

electromigration; eutectic SnPb; line length dependency; jL product;

D O I：

10.3740/MRSK.2007.17.7.371

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In-situ observation of electromigration behavior of eutectic SnPb solder was performed as a function of line length at 100(circle)C, 6x10(4)A/cm condition in a scanning electron microscope chamber. The incubation time for edge drift and the edge drift velocity increase as line length increases, which are discussed with the void nucleation stage of solder bump and the electromigration back flux force, respectively. Finally, the existence of electromigration product (jL) and its line length dependency are also discussed

引用

页码：371 / 375

页数：5

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