A STUDY OF CONTAMINATION AND DAMAGE ON SI SURFACES INDUCED BY DRY ETCHING

被引:26
作者
MOGHADAM, FK
MU, XC
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D O I
10.1109/16.34219
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
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0808 ; 0809 ;
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页码:1602 / 1609
页数:8
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共 20 条
[1]  
BLOM HO, 1986, J VAC SCI TECHNOL A, V4
[2]   RIE CONTAMINATION OF ETCHED SILICON SURFACES [J].
EPHRATH, LM ;
BENNETT, RS .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (08) :1822-1826
[3]  
EPHRATH LM, 1981, J ELECTROCHEM SOC, V123, P2415
[4]   SILICON DAMAGE CAUSED BY CCL4 REACTIVE ION ETCHING - ITS CHARACTERIZATION AND REMOVAL BY RAPID THERMAL ANNEALING [J].
FONASH, SJ ;
SINGH, R ;
ROHATGI, A ;
RAICHOUDHURY, P ;
CAPLAN, PJ ;
POINDEXTER, EH .
JOURNAL OF APPLIED PHYSICS, 1985, 58 (02) :862-866
[5]  
FONASH SJ, 1985, SOLID STATE TECHNOL, V28, P201
[6]   EFFECTS OF WET CLEANING ON SI CONTAMINATED WITH HEAVY-METALS DURING REACTIVE ION ETCHING [J].
HOSOYA, T ;
OZAKI, Y ;
HIRATA, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (10) :2436-2439
[7]  
MARIA DD, 1979, J APPL PHYS, V50, P4015
[8]   CHARACTERIZATION OF REACTIVE ION ETCHED SILICON SURFACE BY DEEP LEVEL TRANSIENT SPECTROSCOPY [J].
MATSUMOTO, H ;
SUGANO, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1982, 129 (12) :2823-2828
[9]  
MOGHADAM F, 1987, INTEL INTERNAL TECH
[10]   A STUDY OF CCIF3/H2 REACTIVE ION ETCHING DAMAGE AND CONTAMINATION EFFECTS IN SILICON [J].
MU, XC ;
FONASH, SJ ;
OEHRLEIN, GS ;
CHAKRAVARTI, SN ;
PARKS, C ;
KELLER, J .
JOURNAL OF APPLIED PHYSICS, 1986, 59 (08) :2958-2967