The interdiffusion kinetics in short period (12.8 nm) Ta/Ni81Fe19 polycrystalline multilayer films has been investigated and related to the evolution of soft magnetic properties upon thermal annealing in the temperature range 300-600-degrees-C. Small angle x-ray diffraction and transmission electron microscopy were used to estimate the multilayer period. Interdiffusion in the multilayers was directly computed from the decay of the satellites near (000) in a small angle x-ray diffraction spectrum. A kinetic analysis of interdiffusion suggests that grain growth is concurrent with grain boundary diffusion of Ta in Ni81Fe19. The evolution of soft magnetic properties of Ni81Fe19, i.e., lowering of 4piM(s) and increase in coercivity H(c), also lend support to the above analysis.
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Univ Santiago Chile, Dept Fis, Santiago 9170124, ChileUniv Santiago Chile, Dept Fis, Santiago 9170124, Chile
Alburquenque, Daniela
Perez-Erices, Lizardo
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Univ Santiago Chile, Dept Fis, Santiago 9170124, ChileUniv Santiago Chile, Dept Fis, Santiago 9170124, Chile
Perez-Erices, Lizardo
Pereira, Alejandro
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Ctr Dev Nanosci & Nanotechnol, Santiago 9170124, ChileUniv Santiago Chile, Dept Fis, Santiago 9170124, Chile
Pereira, Alejandro
Escrig, Juan
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Univ Santiago Chile, Dept Fis, Santiago 9170124, Chile
Ctr Dev Nanosci & Nanotechnol, Santiago 9170124, ChileUniv Santiago Chile, Dept Fis, Santiago 9170124, Chile