STEP COVERAGE IN VACUUM DEPOSITION OF THIN METAL-FILMS

被引：25

作者：

TISONE, TC ^{[1
]}

BINDELL, JB ^{[1
]}

机构：

[1] BELL TEL LABS INC,ALLENTOWN,PA 18103

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1974年 / 11卷 / 01期

关键词：

D O I：

10.1116/1.1318664

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：72 / 76

页数：5

共 15 条

[1] THICKNESS DISTRIBUTION AND STEP COVERAGE IN A NEW PLANETARY SUBSTRATE HOLDER GEOMETRY [J].

BEHRNDT, KH .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (02) :995-&

[2]

BINDELL JB, UNPUBLISHED

[3] EVAPORATED FILM PROFILES OVER STEPS IN SUBSTRATES [J].

BLECH, IA .

THIN SOLID FILMS, 1970, 6 (02) :113-&

[4]

BLECH IA, 1970, P 8 ANN IEEE REL PHY, P144

[5] CALCULATION OF DEPOSITION UNIFORMITY IN RF SPUTTERING [J].

BRODIE, I .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (05) :795-&

[6] SOME CALCULATIONS OF THICKNESS DISTRIBUTION OF FILMS DEPOSITED FROM LARGE AREA SPUTTERING SOURCES [J].

GNAEDINGER, RJ .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (03) :355-+

[7] METAL EDGE COVERAGE AND CONTROL OF CHARGE ACCUMULATION IN RF SPUTTERED INSULATORS [J].

LOGAN, JS ;

MADDOCKS, FS ;

DAVIDSE, PD .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (02) :182-&

[8]

Maissel L.I., 1970, HDB THIN FILM TECHNO

[9]

REIGERT RP, 1973, ELECTRON PACKAGING P, V13, P85

[10] SPUTTERED SIO2 DEPOSITED OVER A STEP [J].

STANDLEY, CL ;

JONES, RE ;

MAISSEL, LI .

THIN SOLID FILMS, 1970, 5 (5-6) :355-&

← 1 2 →