DIFFUSION PROBLEMS IN MICRO-ELECTRONIC PACKAGING

被引:52
作者
HALL, PM
MORABITO, JM
机构
关键词
D O I
10.1016/0040-6090(78)90032-9
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:175 / 182
页数:8
相关论文
共 30 条
[1]  
ABRAMOWITZ M, 1970, HDB MATH FUNCTIONS, P317
[2]  
BRONGERSMA HH, SURF SCI
[3]   AUGER STUDIES OF AU DIFFUSION THROUGH PT FILMS - DEPENDENCE ON ANNEALING AMBIENT [J].
CHANG, CC ;
QUINTANA, G .
APPLIED PHYSICS LETTERS, 1976, 29 (08) :453-454
[4]  
Condra L. W., 1977, 27th Electronic Components Conference, P135
[5]   TERMINATION MATERIALS FOR THIN FILM RESISTORS [J].
FISHER, JS ;
HALL, PM .
PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, 1971, 59 (10) :1418-&
[6]  
GANGULEE A, 1975, THIN SOLID FILMS, V25
[7]  
GERRITSEN AN, 1956, HDB PHYSIK, V19, P210
[8]   METALLIZATION IN MICROELECTRONICS [J].
GHATE, PB ;
BLAIR, JC ;
FULLER, CR .
THIN SOLID FILMS, 1977, 45 (01) :69-84
[9]   GRAIN-BOUNDARY DIFFUSION IN THIN-FILMS .2. MULTIPLE GRAIN-BOUNDARIES AND SURFACE-DIFFUSION [J].
GILMER, GH ;
FARRELL, HH .
JOURNAL OF APPLIED PHYSICS, 1976, 47 (10) :4373-4380
[10]   COMPOSITIONAL DEPTH PROFILING BY AUGER-ELECTRON SPECTROSCOPY [J].
HALL, PM ;
MORABITO, JM .
CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1978, 8 (01) :53-67