PMOS TRANSISTORS IN LPCVD POLYCRYSTALLINE SILICON-GERMANIUM FILMS

被引:36
作者
KING, TJ [1 ]
SARASWAT, KC [1 ]
PFIESTER, JR [1 ]
机构
[1] MOTOROLA INC,ADV PROD RES & DEV LAB,AUSTIN,TX 78721
关键词
D O I
10.1109/55.119205
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
P-channel MOS thin-film transistors (TFT's) have been fabricated in low-pressure chemical vapor deposition (LPCVD) polycrystalline silicon-germanium (poly-SiGe) films using either a low-temperature ( less-than-or-equal-to 600-degrees-C) process or a high-temperature (up to 950-degrees-C) process. Transistors with drawn channel lengths as small as 2-mu-m show well-behaved characteristics. A poly-SiGe TFT technology allows the use of lower anneal temperatures and shorter anneal times as compared to a poly-Si TFT technology. Therefore, it is attractive for a variety of applications including 3-D integrated circuits and large-area display drivers.
引用
收藏
页码:584 / 586
页数:3
相关论文
共 12 条
[1]   A STUDY OF HYDROGEN PASSIVATION OF GRAIN-BOUNDARIES IN POLYSILICON THIN-FILM TRANSISTORS [J].
FAUGHNAN, B ;
IPRI, AC .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1989, 36 (01) :101-107
[2]   ANOMALOUS LEAKAGE CURRENT IN LPCVD POLYSILICON MOSFETS [J].
FOSSUM, JG ;
ORTIZCONDE, A ;
SHICHIJO, H ;
BANERJEE, SK .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (09) :1878-1884
[3]   AVALANCHE-INDUCED EFFECTS IN POLYSILICON THIN-FILM TRANSISTORS [J].
HACK, M ;
LEWIS, AG .
IEEE ELECTRON DEVICE LETTERS, 1991, 12 (05) :203-205
[4]   POLYCRYSTALLINE-SILICON DEVICE TECHNOLOGY FOR LARGE-AREA ELECTRONICS [J].
HAWKINS, WG .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1986, 33 (04) :477-481
[5]  
Ikeda S., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P469, DOI 10.1109/IEDM.1990.237066
[6]  
King T.-J., 1990, International Electron Devices Meeting 1990. Technical Digest (Cat. No.90CH2865-4), P253, DOI 10.1109/IEDM.1990.237181
[7]  
Lewis A. G., 1988, International Electron Devices Meeting. Technical Digest (IEEE Cat. No.88CH2528-8), P260, DOI 10.1109/IEDM.1988.32806
[8]   CHARACTERISTICS AND 3-DIMENSIONAL INTEGRATION OF MOSFETS IN SMALL-GRAIN LPCVD POLYCRYSTALLINE SILICON [J].
MALHI, SDS ;
SHICHIJO, H ;
BANERJEE, SK ;
SUNDARESAN, R ;
ELAHY, M ;
POLLACK, GP ;
RICHARDSON, WF ;
SHAH, AH ;
HITE, LR ;
WOMACK, RH ;
CHATTERJEE, PK ;
LAM, HW .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1985, 32 (02) :258-281
[9]  
Ohshima H., 1989, International Electron Devices Meeting 1989. Technical Digest (Cat. No.89CH2637-7), P157, DOI 10.1109/IEDM.1989.74250
[10]   SILICON-GERMANIUM ALLOYS AND HETEROSTRUCTURES - OPTICAL AND ELECTRONIC-PROPERTIES [J].
PEARSALL, TP .
CRC CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES, 1989, 15 (06) :551-&