EFFECTS OF INTERMETALLIC FORMATION AT THE INTERFACE BETWEEN COPPER AND LEAD TIN SOLDER

被引：79
作者：
PARENT, JOG
CHUNG, DDL
BERNSTEIN, IM
机构：
[1] Carnegie Mellon Univ, United States
来源：
JOURNAL OF MATERIALS SCIENCE | 1988年 / 23卷 / 07期
关键词：
Bond Strength - Lead Tin Solder - Soldered Joints;
D O I：
10.1007/BF01111916
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
(Edited Abstract)
引用
收藏
页码：2564 / 2572
页数：9
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