INVESTIGATION OF SURFACE-ROUGHNESS AND HILLOCK FORMATION ON PLATINIZED SUBSTRATES USED FOR PT/PZT/PT CAPACITOR FABRICATION

被引：8

作者：

KNEER, EA

BIRNIE, DP

SCHRIMPF, RD

PODLESNY, JC

TEOWEE, G

机构：

[1] UNIV ARIZONA,DEPT ELECT & COMP ENGN,TUCSON,AZ 85721

[2] WYKO CORP,TUCSON,AZ 85706

[3] DONNELLY CORP,TUCSON,AZ 85712

来源：

INTEGRATED FERROELECTRICS | 1995年 / 7卷 / 1-4期

关键词：

D O I：

10.1080/10584589508220221

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Hillock formation on Pt bottom electrode surfaces has been investigated for <111> Si and sapphire substrates. This paper correlates the electrical performance of Pt/PZT/Pt structured capacitors with the observed surface roughness and/or hillock presence on the Pt bottom electrode.

引用

页码：61 / 73

页数：13

共 7 条

[1]

BRUCHHAUS R, 1991, MATER RES SOC S P, V243, P123

[2]

HREN PD, 1991, 3RD P INT S INT FERR, P612

[3]

Kneer E. A., 1994, Ferroelectrics, V152, P67, DOI 10.1080/00150199408017598

[4] EFFECTS OF ANNEAL AMBIENTS AND PT THICKNESS ON PT/TI AND PT/TI/TIN INTERFACIAL REACTIONS [J].