ELECTROCHEMICAL KINETIC-PARAMETERS FOR THE CATHODIC DEPOSITION OF COPPER FROM DILUTE AQUEOUS ACID SULFATE-SOLUTIONS

被引：25

作者：

HINATSU, JT ^{[1
]}

FOULKES, FR ^{[1
]}

机构：

[1] UNIV TORONTO,DEPT CHEM ENGN & APPL CHEM,TORONTO M5S 1A4,ONTARIO,CANADA

来源：

CANADIAN JOURNAL OF CHEMICAL ENGINEERING | 1991年 / 69卷 / 02期

关键词：

COPPER ELECTRODEPOSITION KINETICS; CUSO4-H2SO4; SOLUTIONS; VOLTAMMETRY; CHRONOPOTENTIOMETRY;

D O I：

10.1002/cjce.5450690224

中图分类号：

TQ [化学工业];

学科分类号：

0817 ;

摘要：

The use of linear-sweep voltammetry and chronopotentiometry for the determination of kinetic parameters for the electrolytic recovery of copper from a simulated acid-copper electroplating waste solution was demonstrated. For the electrodeposition of copper from solutions of 0.007 approximately 0.008 mol/L CuSO4 + 0.5 mol/L H2SO4 at 25-degrees-C, the recommended values of the transfer coefficient (alpha) and exchange current density (i0) are alpha = 0.46 +/- 0.06 (95% confidence interval) and i0 = 11 +/- 4 A/m2. The close agreement between these values and the available literature values indicates the reliabilaity of the voltammetric and chronopotentiometric methods.

引用

页码：571 / 577

页数：7