ELECTROCHEMICAL KINETIC-PARAMETERS FOR THE CATHODIC DEPOSITION OF COPPER FROM DILUTE AQUEOUS ACID SULFATE-SOLUTIONS

被引:23
|
作者
HINATSU, JT [1 ]
FOULKES, FR [1 ]
机构
[1] UNIV TORONTO,DEPT CHEM ENGN & APPL CHEM,TORONTO M5S 1A4,ONTARIO,CANADA
来源
CANADIAN JOURNAL OF CHEMICAL ENGINEERING | 1991年 / 69卷 / 02期
关键词
COPPER ELECTRODEPOSITION KINETICS; CUSO4-H2SO4; SOLUTIONS; VOLTAMMETRY; CHRONOPOTENTIOMETRY;
D O I
10.1002/cjce.5450690224
中图分类号
TQ [化学工业];
学科分类号
0817 ;
摘要
The use of linear-sweep voltammetry and chronopotentiometry for the determination of kinetic parameters for the electrolytic recovery of copper from a simulated acid-copper electroplating waste solution was demonstrated. For the electrodeposition of copper from solutions of 0.007 approximately 0.008 mol/L CuSO4 + 0.5 mol/L H2SO4 at 25-degrees-C, the recommended values of the transfer coefficient (alpha) and exchange current density (i0) are alpha = 0.46 +/- 0.06 (95% confidence interval) and i0 = 11 +/- 4 A/m2. The close agreement between these values and the available literature values indicates the reliabilaity of the voltammetric and chronopotentiometric methods.
引用
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页码:571 / 577
页数:7
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