THIN ZINC FILMS ON ALUMINUM

[1] BAILEY GLJ, 1951, J ELECTRODEPOSITORS, V27, P233

[2] BUCKLEY DH, 1969, P C PHYSICS ADHESION

[3] Bullough W., 1947, J ELECTRODEPOSITORS, V22, P169

[4] DIGGIN MB, 1947, METAL FINISHING, V45, P67

[5] GROWTH OF THIN NICKEL FILMS ON A (III) ALUMINIUM SURFACE [J]. THIN SOLID FILMS, 1970, 5 (02) : 69 - &

[6] DEPOSITION OF METALS ON ALUMINUM BY IMMERSION FROM SOLUTIONS CONTAINING FLUORIDES [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1949, 95 (05) : 205 - 225

[7] PREPARATION AND PROPERTIES OF CLEAN SURFACES OF ALUMINUM [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1967, 28 (11) : 2155 - &

[8] CONDITIONING ALUMINUM ALLOYS FOR ELECTROPLATING [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1950, 97 (04) : 143 - 151

[9] KELLER F, 1949, P AM ELECTROPLAT SOC, V22, P149

[10] LASHMORE DS, 1978, PLATING SURFACE APR, P44

[1] BAILEY GLJ, 1951, J ELECTRODEPOSITORS, V27, P233

[2] BUCKLEY DH, 1969, P C PHYSICS ADHESION

[3] Bullough W., 1947, J ELECTRODEPOSITORS, V22, P169

[4] DIGGIN MB, 1947, METAL FINISHING, V45, P67

[5] GROWTH OF THIN NICKEL FILMS ON A (III) ALUMINIUM SURFACE [J]. THIN SOLID FILMS, 1970, 5 (02) : 69 - &

[6] DEPOSITION OF METALS ON ALUMINUM BY IMMERSION FROM SOLUTIONS CONTAINING FLUORIDES [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1949, 95 (05) : 205 - 225

[7] PREPARATION AND PROPERTIES OF CLEAN SURFACES OF ALUMINUM [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1967, 28 (11) : 2155 - &

[8] CONDITIONING ALUMINUM ALLOYS FOR ELECTROPLATING [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1950, 97 (04) : 143 - 151

[9] KELLER F, 1949, P AM ELECTROPLAT SOC, V22, P149

[10] LASHMORE DS, 1978, PLATING SURFACE APR, P44