Crack Healing Behavior with Healing Temperature in Si3N4/SiC Composite Ceramics

被引：0
|
作者：
Song, Ohsung [1 ]
Ando, Kotoji [2 ]
Takahashi, Koji [2 ]
Nakao, Wataru [2 ]
Ryu, Jiho [3 ]
机构：
[1] Univ Seoul, Dept Mat Sci & Engn, Seoul 130743, South Korea
[2] Yokohama Natl Univ, Dept Energy & Safety Engn, 79-5 Hodogaya, Yokohama, Kanagawa, Japan
[3] Ajou Motor Coll, Div Automobile, Boryeong 355769, South Korea
来源：
KOREAN JOURNAL OF MATERIALS RESEARCH | 2005年 / 15卷 / 12期
关键词：
crack healing; healing temperature; diffusion coefficient; surface crack;
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
To investigate the microcrack healing behavior of Si3N4-20wt%SiC-8wt%Y2O3 composite ceramics(SNCY8), we observe the crack length evolution at the time of 20, 40, 60 minutes with in -situ optical microscopy by varying healing temperature of 8001200 degrees C. Crack healing obviously occurred as healing temperature and time increased. We proposed a simple model of effective diffusion based on the crack length evolution with healing condition, and determined the effective diffusion coefficient as. Our result implies that we may predict the healiv ability quantitatively with temperature and time in structural ceramics through the effective diffusion coefficient model.
引用
收藏
页码：780 / 785
页数：6
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