THE DESIGN OF THE ES/9000 MODULE

被引：5

作者：

DAVIDSON, EE

HARDIN, PW

KATOPIS, GA

NEALON, MG

WU, LL

机构：

[1] IBM General Technology Division, IBM East Fishkill Facility, Hopewell Junction

来源：

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1991年 / 14卷 / 04期

关键词：

D O I：

10.1109/33.105127

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The new ES/9000 thermal conduction module (TCM) is a significant improvement over the TCM's used in the current IBM 3090 series of mainframes. Included in the features of this new module, which supports an order of magnitude increase in usable circuits, are a glass ceramic substrate material, buried engineering change wires, partial thin film redistribution, and on-module decoupling capacitors. A description of the physical attributes and the electrical design considerations will be given. The result is a packaged electronic technology that supports approximately a two times faster machine cycle time than the original 3090 technology.

引用

页码：744 / 748

页数：5