FACING TARGETS TYPE OF SPUTTERING METHOD FOR DEPOSITION OF MAGNETIC METAL-FILMS AT LOW-TEMPERATURE AND HIGH-RATE

被引：143

作者：

NAOE, M

YAMANAKA, SI

HOSHI, Y

机构：

来源：

关键词：

D O I：

10.1109/TMAG.1980.1060683

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：646 / 648

页数：3

共 5 条

[1]

CHAPIN JS, 1974, RES DEV, V25, P37

[2]

HOSOKAWA N, SHINKU, V16, P327

[3] TEMPERATURE RISE DURING FILM DEPOSITION BY RF AND DC SPUTTERING [J].

LAU, SS ;

MILLS, RH ;

MUTH, DG .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1972, 9 (04) :1196-&

THORNTON, JA .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :171-177

[5] PLANAR MAGNETRON SPUTTERING [J].

WAITS, RK .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1978, 15 (02) :179-187