OPTIMIZING MANUFACTURING CONDITIONS OF PHENOLIC RESIN BONDED PARTICLEBOARD .1. STUDIES ON VARIOUS FACTORS AFFECTING BONDING QUALITY

被引:8
作者
MAY, HA
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D O I
10.1007/BF02607687
中图分类号
TB3 [工程材料学]; TS [轻工业、手工业、生活服务业];
学科分类号
0805 ; 080502 ; 0822 ;
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页码:441 / 449
页数:9
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