THICK-FILM PASTES FOR MULTILAYER USE

被引：0
作者：
KURZWEIL, K
LOUGHRAN, J
机构：
[1] SOCIETE HONEYWELL BULL,ADV DEV LAB,ST OUEN,FRANCE
[2] GE,CORP RES & DEV,SCHENECTADY,NY 12300
来源：
SOLID STATE TECHNOLOGY | 1973年 / 16卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：36 / 42
页数：7
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