A MICROSTRUCTURAL STUDY OF THE THERMAL FATIGUE FAILURES OF 60SN-40PB SOLDER JOINTS

[11] THERMAL DEFORMATIONS OBSERVED IN LEADLESS CERAMIC CHIP CARRIERS SURFACE MOUNTED TO PRINTED WIRING BOARDS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (04): : 544 - 552

[12] SOLDER POST ATTACHMENT OF CERAMIC CHIP CARRIERS TO CERAMIC FILM INTEGRATED-CIRCUITS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 403 - 410

[13] KANG SK, 1977, IEEE T PARTS HYB PAC, V13, P318, DOI 10.1109/TPHP.1977.1135203

[14] TEMPERATURE CYCLING OF HIC THIN-FILM SOLDER CONNECTIONS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (01): : 132 - 139

[15] KUBIK EC, THERMAL SHOCK TEMPER

[16] ANALYSIS OF THERMAL CYCLE FATIGUE DAMAGE IN MICROSOCKET SOLDER JOINTS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 515 - 519

[17] THE EFFECT OF HIGH DISSIPATION COMPONENTS ON THE SOLDER JOINTS OF CERAMIC CHIP CARRIERS ATTACHED TO THICK-FILM ALUMINA SUBSTRATES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (03): : 237 - 245

[18] LYNCH JT, 1982, 32ND P EL COMP C, V32, P385

[19] INFLUENCE OF SEVERAL DESIGN AND MATERIAL VARIABLES ON PROPENSITY FOR SOLDER JOINT CRACKING [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04): : 296 - 304

[20] RELIABILITY OF CONTROLLED COLLAPSE INTERCONNECTIONS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) : 266 - +

[11] THERMAL DEFORMATIONS OBSERVED IN LEADLESS CERAMIC CHIP CARRIERS SURFACE MOUNTED TO PRINTED WIRING BOARDS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (04): : 544 - 552

[12] SOLDER POST ATTACHMENT OF CERAMIC CHIP CARRIERS TO CERAMIC FILM INTEGRATED-CIRCUITS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 403 - 410

[13] KANG SK, 1977, IEEE T PARTS HYB PAC, V13, P318, DOI 10.1109/TPHP.1977.1135203

[14] TEMPERATURE CYCLING OF HIC THIN-FILM SOLDER CONNECTIONS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (01): : 132 - 139

[15] KUBIK EC, THERMAL SHOCK TEMPER

[16] ANALYSIS OF THERMAL CYCLE FATIGUE DAMAGE IN MICROSOCKET SOLDER JOINTS [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 515 - 519

[17] THE EFFECT OF HIGH DISSIPATION COMPONENTS ON THE SOLDER JOINTS OF CERAMIC CHIP CARRIERS ATTACHED TO THICK-FILM ALUMINA SUBSTRATES [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1983, 6 (03): : 237 - 245

[18] LYNCH JT, 1982, 32ND P EL COMP C, V32, P385

[19] INFLUENCE OF SEVERAL DESIGN AND MATERIAL VARIABLES ON PROPENSITY FOR SOLDER JOINT CRACKING [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1975, 11 (04): : 296 - 304

[20] RELIABILITY OF CONTROLLED COLLAPSE INTERCONNECTIONS [J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) : 266 - +