A NEW LOOK AT THE RELIABILITY OF THIN-FILM METALLIZATIONS FOR MICROELECTRONIC DEVICES

被引：0
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作者：
HUMMEL, RE
机构：
来源：
FESTKORPER PROBLEME - ADVANCES IN SOLID STATE PHYSICS, VOL 29 | 1989年 / 29卷
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中图分类号：
O469 [凝聚态物理学];
学科分类号：
070205 ;
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页码：251 / 266
页数：16
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