PACKAGING AND INTERCONNECTION OF SENSORS

Chip mounting methods, chip-substrate interconnection techniques, encapsulation processes, design methods and technologies for multi-chip systems must all be considered in microelectronic packaging. In the case of sensors, as well as the electrical contacts for signal outputs and power distribution, the input of the non-electrical measurement signals must be realized. Parts of the sensor are therefore in direct contact with environmental physical and chemical parameters which can degrade the reliability. Therefore the requirements for sensor packaging technologies are related to specific measurement problems. In general, sensor packaging has to deliver reliable, economical and application-oriented solutions by choosing optimal technologies and material combinations.