INTRAPLANE GUIDED WAVE MASSIVE FANOUT OPTICAL INTERCONNECTIONS

One-to-30 guided wave optical interconnections are demonstrated at 632.8 nm using a highly multiplexed waveguide volume hologram. This technology is capable of providing intrachip and intrawafer optical interconnections. The theoretical limit of the fanout number is addressed and experimentally confirmed. The measured data show that the diffracted beams have an average diffraction efficiency of 2.3% with ±0.2% variation. The demonstrated results can save surface space of electronic chips and also provide a large fanout capability due to the high index modulation of the volume hologram. Further applications based on this technology are very promising. Head-up display, high-speed optical data bus, surface enhanced Raman spectrometer, and optical sensors are some of the attractive ones.