INTERMETALLIC COMPOUNDS OF AL AND TRANSITIONS METALS - EFFECT OF ELECTROMIGRATION IN 1-2-MUM-WIDE LINES

被引：109

作者：

HOWARD, JK ^{[1
]}

WHITE, JF ^{[1
]}

HO, PS ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

JOURNAL OF APPLIED PHYSICS | 1978年 / 49卷 / 07期

基金：

美国国家科学基金会;

关键词：

D O I：

10.1063/1.325369

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：4083 / 4093

页数：11

共 18 条

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AGARWALA BN, 1970, J APPL PHYS, V41, P3945

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[3]

BOWER RW, 1973, APPL PHYS LETT, V23, P99, DOI 10.1063/1.1654823

[4] PRINCIPLES AND APPLICATIONS OF ION-BEAM TECHNIQUES FOR ANALYSIS OF SOLIDS AND THIN-FILMS [J].

CHU, WK ;

MAYER, JW ;

NICOLET, MA ;

BUCK, TM ;

AMSEL, G ;

EISEN, F .

THIN SOLID FILMS, 1973, 17 (01) :1-41

[5]

DEHOFF RT, 1968, QUANTITATIVE MICROSC, P228

[6]

DHeurle F. M., 1973, PHYS THIN FILMS, V7, P257

[7]

DHEURLE FM, 1973, NATURE BEHAVIOR GRAI, P339

[8] KIRKENDALL STUDY OF ELECTROMIGRATION IN THIN-FILMS [J].

HO, PS ;

LEWIS, JE ;

HOWARD, JK .

THIN SOLID FILMS, 1975, 25 (02) :301-315

[9]

HO PT, UNPUBLISHED

[10]

HOWARD J, UNPUBLISHED

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