ADHESION MECHANISM OF GOLD-UNDERLAYER FILM COMBINATIONS TO OXIDE SUBSTRATES

被引：30

作者：

HAQ, KE

BEHRNDT, KH

KOBIN, I

机构：

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY | 1969年 / 6卷 / 01期

关键词：

D O I：

10.1116/1.1492648

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：148 / &

共 10 条

[1]

BATESON S, 1952, VACUUM, V2, P635

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BENJAMIN, P ;

WEAVER, C .

[3]

BOROM MP, 1966, J AMER CER SOC, V49

[4] MATERIALS AND PROCESSES FOR PASSIVE THIN-FILM COMPONENTS [J].

GLANG, R .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1966, 3 (02) :37-&

[5]

HOLLAND L, 1956, VACUUM DEPOSITION TH

[6]

HUMERICK W, 1954, J AM CERAM SOC, V37, P18

[7]

MCDONALD JE, 1965, T METALL SOC AIME, V233, P512

[8]

RUTZLER JE, 1954, ADHESIVES FUNDAME ED

[9]

WEYL WA, 1954, ADHESIVES FUNDAMENTA

[10]

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