RECENT APPLICATIONS OF POLYIMIDE TO MICROMACHINING TECHNOLOGY

被引：34

作者：

FRAZIER, AB ^{[1
]}

机构：

[1] LOUISIANA TECH UNIV,INST MICROMFG,DEPT ELECT ENGN,RUSTON,LA 71272

来源：

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS | 1995年 / 42卷 / 05期

关键词：

Composite materials - Electroplating - Graphite - Mechanical properties - Metal molding - Metallographic microstructure - Microelectronic processing - Micromachining - Molds - Photosensitivity - Sensors;

D O I：

10.1109/41.464605

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

In this paper, recent applications of polyimide materials to micromachining technology are reviewed. First, the use of polyimide-based materials as sensor materials are discussed. In this case, the polyimide material is used as an integral part of the micromachined devices. Emphasis is given to the development and characterization of a piezoresistive composite of polyimide and graphite particles. The composite material is characterized for the mechanical properties (Young's modulus, residual stress) and the electromechanical property (piezoresistive coefficient). Second, the use of both photosensitive and nonphotosensitive polyimides as electroplating molds for the fabrication of thick and high aspect ratio metallic microstructures is presented, Extensions of the basic micromolding process, which enable the fabrication of controlled gaps between metallic microstructural components and higher aspect ratio microstructures, are presented. Electroplated metallic microstructures realized using these technologies are shown, In addition, various applications of the polyimide micromolding technologies are discussed.

引用

页码：442 / 448

页数：7

共 37 条

[1]

Chakravorty K., Chien C., Cech J., Branson L., Atencio J., White T., Lathrop L., Aker B., Tanielian M., Young P., High density interconnection using photosensitive polyimide and electroplated copper conductor lines, Proc. 39th Electron. Components Conf., pp. 135-142, (1989)

[2]

Moriya K., Ohsaki T., Katsura K., Photosensitive polyimide dielectric and electroplating conductor, Proc. 34th Electron. Components Conf., pp. 82-87, (1984)

[3]

Milosevic I., Perret A., Losert E., Schlenkrich P., Polyimide enables high lead count TAB, Semiconductor Int., pp. 28-31, (1988)

[4]

Rickerl P.G., Stephanie J.G., Slota P., Processing of photosensitive polyimides for packaging applications, IEEE Trans. Components, Hybrids, and Manufacturing Technol, pp. 690-694, (1987)

[5]

Dishon G., Bobbio S., Tessier T., Ho Y., Jewett R., High rate magnetron RIE of thick polyimide films for advanced computer packaging applications, J. Electron. Materials, 18, pp. 293-299, (1989)

[6]

Adema G., Turlik I., Smith P., Berry M., Effects of polymer/metal interaction in thin-film multichip module applications, Proc. 40th Electron. Components Conf., pp. 717-726, (1990)

[7]

Parylin PD Processing Guidelines PI-2700, Paralyin PD Polyimide Coatings Technical Literature, (1994)

[8]

Kim Y., Allen M., Single- and multi-layer surface-micromachined platforms using electroplated sacrificial layers, Sensors and Actuators A, 35, pp. 61-68, (1992)

[9]

Wilkinson S., Kim Y., Jokerst N., Allen M., Compound semiconductor photonic devices onto micromachined movable platforms, 7th Int. Conf. Solid-State Sensors and Actuators, pp. 148-153, (1993)

[10]

Camperi-Ginestet C., Kim Y., Jokerst N., Allen M., Brooke M., Vertical electrical interconnection of component semiconductor thin-film devices to underlying silicon circuitry, IEEE Photon. Technol. Lett., 4, pp. 1003-1006, (1992)

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