TERMINATION MATERIALS FOR THIN FILM RESISTORS

被引:21
作者
FISHER, JS
HALL, PM
机构
来源
PROCEEDINGS OF THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS | 1971年 / 59卷 / 10期
关键词
D O I
10.1109/PROC.1971.8448
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:1418 / &
相关论文
共 8 条
[1]  
CASTRO PS, 1961, ELECTRON ENG, V80, P535
[2]  
CUNNINGHAM JA, 1970 IEEE INT EL DEV, P50
[3]  
FISHER JS, 1968 P IEEE EL COMP, P299
[4]   EVALUATION OF INTERFACIAL RESISTANCE OF THIN FILM INTERCONNEXIONS [J].
GALLA, RT ;
GREENHOU.HM ;
VERGARA, WC .
MICROELECTRONICS RELIABILITY, 1968, 7 (03) :185-&
[5]   ADHESION MECHANISM OF GOLD-UNDERLAYER FILM COMBINATIONS TO OXIDE SUBSTRATES [J].
HAQ, KE ;
BEHRNDT, KH ;
KOBIN, I .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (01) :148-&
[6]  
HUGHES VC, AD850084
[7]  
HUGHES VC, 1969, NAFITR1369 ASTIA REP
[8]  
WILSON RW, 1970, ELECTRONIC PACKAGI 2, pMC29