MECHANISM OF CORROSION IN AL-SI-CU

被引：15

作者：

HAYASAKA, N ^{[1
]}

KOGA, Y ^{[1
]}

SHIMOMURA, K ^{[1
]}

YOSHIDA, Y ^{[1
]}

OKANO, H ^{[1
]}

机构：

[1] TOSHIBA CO LTD,DEPT INTEGRATED CIRCUIT ADV PROC ENGN,MOS PROC ENGN SEC,SAIWAI KU,KAWASAKI 210,JAPAN

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1991年 / 30卷 / 07期

关键词：

AL-SI-CU; CORROSION; LOCAL CELL; CONTACT; PHOTOELECTROMOTIVE FORCE; MOISTURE; CU PRECIPITATION;

D O I：

10.1143/JJAP.30.1571

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

An Al-Cu local cell was formed between the Cu precipitation and adjacent Al in an Al-Si-Cu alloy when Cu was added in excess to the alloy. Once an Al-Cu local cell was formed, corrosion took place simply by dipping the alloy in deionized water without any contamination. Furthermore, it was found that corrosion was enhanced at the Al-Si-Cu lines in contact with the p+-n junction of Si. The reason for this is that holes are injected into Al-Si-Cu from p+-Si due to electromotive force produced by light irradiation and an external circuit connecting the alloy and n-Si formed by the adsorption of moisture on the surface. Furthermore, it was found that the irradiation of light with a wavelength between 320 to 380 nm was most effective in enhancing the corrosion reaction.

引用

页码：1571 / 1575

页数：5

共 9 条

[1] REDUCTION OF ELECTROMIGRATION IN ALUMINUM FILMS BY COPPER DOPING [J].

AMES, I ;

DHEURLE, FM ;

HORSTMANN, RE .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1970, 14 (04) :461-+

[2]

GROVE AS, 1967, PHYS TECHNOL S, P347

[3] ALUMINUM REACTIVE ION ETCHING EMPLOYING CCL4+CL2 MIXTURE [J].

HORIIKE, Y ;

YAMAZAKI, T ;

SHIBAGAKI, M ;

KURISAKI, T .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1982, 21 (10) :1412-1420

[4] REACTIVE ION ETCHING INDUCED CORROSION OF AL AND AL-CU FILMS [J].

LEE, WY ;

ELDRIDGE, JM ;

SCHWARTZ, GC .

JOURNAL OF APPLIED PHYSICS, 1981, 52 (04) :2994-2999

[5] CORROSION-INDUCED CONTACT FAILURES IN DOUBLE-LEVEL AL-SI-CU METALLIZATION [J].

MAYUMI, S ;

MUROZONO, I ;

NANATSUE, H ;

UEDA, S .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (06) :1861-1867

[6]

MAYUMI S, 1987, 25TH ANN P REL PHYS, P13

[7]

PHYLOFSKY E, 1971, 9TH ANN P REL PHYS S, P120

[8] MICRO-CORROSION OF AL-CU BONDING PADS [J].

THOMAS, S ;

BERG, HM .

IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02) :252-257

[9]

Turner T., 1985, 23rd Annual Proceedings Reliability Physics 1985 (Cat. No. 85CH2113-9), P142, DOI 10.1109/IRPS.1985.362089

← 1 →