RELIABILITY ASSURANCE OF APPLICATION-SPECIFIC MICROELECTRONIC CIRCUITS

被引：0

作者：

SHEU, BJ

HSU, WJ

TYREE, V

机构：

来源：

PROCEEDINGS ANNUAL RELIABILITY AND MAINTAINABILITY SYMPOSIUM | 1990年 / SYM期

关键词：

COMPUTER-AIDED RELIABILITY PREDICTION; RELIABILITY MODELING; CIRCUIT RELIABILITY SIMULATION; DESIGN FOR RELIABILITY; HOT CARRIER EFFECT; ELECTROMIGRATION; VLSI;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

To provide intelligent design automation systems for microelectronics designers to explore the full capabilities of the state-of-the-art fabrication technologies, an integrated-circuit reliability simulator has been developed. Model parameters for the reliability simulation are obtained through accelerated tests on specially-designed test structures. Design of several test chips and associated experimental results are presented. The integrated-circuit reliability simulation is to be extensively used in the modern microelectronics industry to provide useful product reliability data.

引用

页码：381 / 388

页数：8