HYBRID INTEGRATION OF SURFACE-EMITTING MICROLASER CHIP AND PLANAR OPTICS SUBSTRATE FOR INTERCONNECTION APPLICATIONS

Compact packaging of optoelectronic systems using free-space light propagation is one of the major problems for interconnection applications. The hybrid integration of optoelectronic chips with planarized microoptic systems is a viable technique to solve this problem. We report the bonding of a monolithic array of surface-emitting microlasers onto a glass substrate that contains a matching array of microlenses and mirrors. The bonding was achieved by flip-chip solder bump bonding using indium as the solder material. The alignment precision is within +/-2 mum. The optical substrate provides a simple interconnection scheme that routes the light from each laser to well defined output positions.