RESIDUAL STRAINS OF PB THIN-FILMS DEPOSITED ONTO SI SUBSTRATES

被引：71
作者：
MURAKAMI, M
机构：
来源：
ACTA METALLURGICA | 1978年 / 26卷 / 01期
关键词：
D O I：
10.1016/0001-6160(78)90214-6
中图分类号：
TF [冶金工业];
学科分类号：
0806 ;
摘要：
引用
收藏
页码：175 / 183
页数：9
相关论文
共 28 条
[1]   FIRST REPORT ON DEFORMATION-MECHANISM MAPS [J].
ASHBY, MF .
ACTA METALLURGICA, 1972, 20 (07) :887-+
[2]   LOW-TEMPERATURE PROPERTIES OF EVAPORATED LEAD FILMS [J].
CASWELL, HL ;
PRIEST, JR ;
BUDO, Y .
JOURNAL OF APPLIED PHYSICS, 1963, 34 (11) :3261-&
[3]   HILLOCK GROWTH IN THIN-FILMS [J].
CHAUDHAR.P .
JOURNAL OF APPLIED PHYSICS, 1974, 45 (10) :4339-4346
[4]   MECHANISMS OF STRESS RELIEF IN POLYCRYSTALLINE FILMS [J].
CHAUDHARI, P .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (02) :197-+
[5]  
Chirvinskii P. N., 1948, METEORITIKA, P75
[6]   A MODEL FOR BOUNDARY DIFFUSION CONTROLLED CREEP IN POLYCRYSTALLINE MATERIALS [J].
COBLE, RL .
JOURNAL OF APPLIED PHYSICS, 1963, 34 (06) :1679-&
[7]   STRUCTURE OF ELECTROPLATED AND VAPOR-DEPOSITED COPPER FILMS [J].
GANGULEE, A .
JOURNAL OF APPLIED PHYSICS, 1972, 43 (03) :867-+
[8]   STRAIN-RELAXATION IN THIN-FILMS ON SUBSTRATES [J].
GANGULEE, A .
ACTA METALLURGICA, 1974, 22 (02) :177-183
[9]   DIFFUSION CREEP OF A THIN FOIL [J].
GIBBS, GB .
PHILOSOPHICAL MAGAZINE, 1966, 13 (123) :589-&
[10]  
GRAY DE, 1972, AM I PHYSICS HDB
123