THE USE OF CONDUCTING POLYMERS AND COLLOIDS IN THE THROUGH HOLE PLATING OF PRINTED-CIRCUIT BOARDS

被引：28

作者：

MEYER, H

NICHOLS, RJ

SCHROER, D

STAMP, L

机构：

[1] Atotech Deutschland GmbH, 10553 Berlin

来源：

ELECTROCHIMICA ACTA | 1994年 / 39卷 / 8-9期

关键词：

PLATING THROUGH HOLE; PRINTED CIRCUIT BOARDS; DIRECT METALLIZATION; CONDUCTING POLYMERS; SCANNING PROBE MICROSCOPY;

D O I：

10.1016/0013-4686(94)E0055-5

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

There has been a considerable amount of activity in the last few years aimed at the development of alternative methods for the plating of printed circuit boards through holdes. Processes involving colloids or conducting polymers have been particularly important front runners. In this paper the scientific and technical aspects of plating through holes are described and discussed. Methods which have been recently used to examine these processes (in particular scanning probe microscopies) are also discussed.

引用

页码：1325 / 1338

页数：14