SOME TITANIUM GERMANIUM AND SILICON-COMPOUNDS - REACTION AND PROPERTIES

被引:51
作者
THOMAS, O [1 ]
DHEURLE, FM [1 ]
DELAGE, S [1 ]
机构
[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
关键词
D O I
10.1557/JMR.1990.1453
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Titanium reacts with pure Ge in two different ways: At low temperatures one observes the formation of Ti6Ge5 with some characteristics typical of diffusion-controlled reaction. Upon completion of this first stage Ti6Ge5 reacts with remaining Ge to form TiGe2, isomorphous with C54 TiSi2, in a process which is clearly controlled by nucleation. The same observations apply to reactions with a Ge alloy containing 25 at.% Si. With an alloy containing 50 at.% Si the two stages become merged, so that while remaining identifiable, they are much less distinct than with the previous conditions. The reaction behavior observed with a Ge alloy containing 80 at.% Si resembles that generally obtained with pure Si: there are no easily identifiable steps between the initial Si-Ti sample and the final one, Si-TiSi2. With both the 50–50 and 80–20 Si-Ge alloys the formation of the C54 structure is preceded by that of the C49 structure (ZrSi2 type), as with pure Si. The gradual merging of the diffusion-controlled reaction and that controlled by nucleation as the concentration of Si in the substrate increases implies that nucleation plays a significant role in the formation of TiSi2, even if that role cannot be easily isolated. Effects due to gas impurities on the path of the metal-substrate reaction have been analyzed. The resistivities of several pure and alloyed phases have been measured. Alloy scattering in the system TiSi2-TiGe2is briefly discussed. © 1990, Materials Research Society. All rights reserved.
引用
收藏
页码:1453 / 1462
页数:10
相关论文
共 49 条
[1]  
ANGILELLO J, 1980, THIN FILM INTERFACES, P213
[2]   SOLID-STATE REACTIONS OF TA-W THIN-FILMS AND SI SINGLE-CRYSTALS [J].
APPELBAUM, A ;
EIZENBERG, M ;
BRENER, R .
VACUUM, 1983, 33 (04) :227-230
[3]   FORMATION OF SILICIDES IN MO-W BILAYER FILMS ON SI SUBSTRATES - MARKER EXPERIMENT [J].
BAGLIN, J ;
DEMPSEY, J ;
HAMMER, W ;
DHEURLE, F ;
PETERSSON, S ;
SERRANO, C .
JOURNAL OF ELECTRONIC MATERIALS, 1979, 8 (05) :641-661
[4]   TITANIUM SILICIDE FORMATION - EFFECT OF OXYGEN DISTRIBUTION IN THE METAL-FILM [J].
BERTI, M ;
DRIGO, AV ;
COHEN, C ;
SIEJKA, J ;
BENTINI, GG ;
NIPOTI, R ;
GUERRI, S .
JOURNAL OF APPLIED PHYSICS, 1984, 55 (10) :3558-3565
[5]   METASTABLE PHASE FORMATION IN TITANIUM-SILICON THIN-FILMS [J].
BEYERS, R ;
SINCLAIR, R .
JOURNAL OF APPLIED PHYSICS, 1985, 57 (12) :5240-5245
[6]   RESIDUAL RESISTIVITY OF COPPER AND SILVER ALLOYS - DEPENDENCE ON PERIODIC TABLE [J].
BLATT, FJ .
PHYSICAL REVIEW, 1957, 108 (02) :285-290
[7]  
Borisov V.T., 1964, FIZ MET METALLOVED, V17, P881
[8]  
BOTHA AP, 1982, P MATER RES SOC S, V10, P129
[9]   SELF-ALIGNED TI SILICIDE FORMED BY RAPID THERMAL ANNEALING [J].
BRAT, T ;
OSBURN, CM ;
FINSTAD, T ;
LIU, J ;
ELLINGTON, B .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (07) :1451-1458
[10]  
CAHOON EC, 1984, P MATER RES SOC S, V25, P57