HOLE GENERATION WITHOUT ANNEALING IN HIGH-DOSE BORON-IMPLANTED SILICON - HEAVY DOPING BY B-12 ICOSAHEDRON AS A DOUBLE ACCEPTOR

被引:34
作者
MIZUSHIMA, I [1 ]
MURAKOSHI, A [1 ]
WATANABE, M [1 ]
YOSHIKI, M [1 ]
HOTTA, M [1 ]
KASHIWAGI, M [1 ]
机构
[1] TOSHIBA CO LTD,CTR RES & DEV,ENVIRONM ENGN LAB,SAIWAI KU,KAWASAKI,KANAGAWA 210,JAPAN
来源
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1994年 / 33卷 / 1B期
关键词
BORON; ION IMPLANTATION; HOLE; ACTIVATION; CARRIER CONCENTRATION; XPS; FTIR;
D O I
10.1143/JJAP.33.404
中图分类号
O59 [应用物理学];
学科分类号
摘要
A high hole concentration region of about 1 x 10(21) cm(-3) was generated without any post-annealing by the implantation of high doses of boron into silicon substrates. X-ray photoelectron spectroscopy (XPS) measurement and Fourier transform IR spectroscopy (FTIR) absorption spectra revealed that B-12 icosahedra were created in as-implanted samples. A new model of the generation of holes is proposed in which B-12 icosahedron acts as a double acceptor.
引用
收藏
页码:404 / 407
页数:4
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