MOLECULAR-DYNAMICS SIMULATION OF DISPLACEMENT CASCADES IN CU AND NI - THERMAL SPIKE BEHAVIOR

被引：178

作者：

DELARUBIA, TD

AVERBACK, RS

HSIEH, H

BENEDEK, R

机构：

[1] UNIV ILLINOIS,DEPT MAT SCI & ENGN,URBANA,IL 61801

[2] ARGONNE NATL LAB,DIV MAT SCI,ARGONNE,IL 60439

[3] SUNY ALBANY,DEPT PHYS,ALBANY,NY 12222

来源：

关键词：

D O I：

10.1557/JMR.1989.0579

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：579 / 586

页数：8

共 38 条

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