PACKAGE INDUCTANCE CHARACTERIZATION AT HIGH-FREQUENCIES

This paper describes a package inductance measurement technique based on network analysis and lumped element package model. Advantages of this technique include: 1. Measuring inductance over the same high operating frequencies of today's high-speed CMOS and ECL chips, 2. Providing information on a package's resonance frequencies and determining the limit of the lumped element model, and 3. Utilizing a simple one-port measurement method, procedure and fixture design. Different packages and interconnects including a 120QFP, a 296TAB tape, a multilayer 224PGA and bonding wires of different length were characterized using this technique. Where possible, the inductance results obtained by this technique were compared with both modeling data and measurement data obtained by the conventional LCZ technique. In addition, the experiments were extended to compare the effective inductance of the ground path of one-metal and two-metal 360TAB tapes. The results provide important guidelines in determining design tradeoffs between one-metal and two-metal TAB tapes.