A NEW NON-CONTACTING METHOD FOR DETECTING STRESS WAVES

被引：0
|
作者：
SAHA, S [1 ]
REDDY, GN [1 ]
机构：
[1] LOUISIANA STATE UNIV,MED CTR,SHREVEPORT,LA 71105
来源：
EXPERIMENTAL MECHANICS | 1980年 / 20卷 / 05期
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
引用
收藏
页码：N40 / N40
页数：1
相关论文
共 50 条
  • [1] Non-contacting stress measurement
    Dover, WD
    Zhou, J
    INSIGHT, 1998, 40 (05) : 340 - 343
  • [2] StressProbe -: A new non-contacting stress measurement technique
    Dover, WD
    Karé, RF
    Brennan, FP
    STRAIN, 2005, 41 (04) : 185 - 192
  • [3] Non-contacting residual stress decay detecting using alternating current stress measurement
    Chen, K
    Brennan, FP
    Dover, WD
    JOURNAL OF STRAIN ANALYSIS FOR ENGINEERING DESIGN, 2000, 35 (04): : 227 - 233
  • [4] NON-CONTACTING TECHNIQUES FOR PLANT DROUGHT STRESS DETECTION
    Yang, Y.
    Ling, P.
    Fleisher, D. H.
    Timlin, D. J.
    Reddy, V. R.
    TRANSACTIONS OF THE ASABE, 2008, 51 (04): : 1483 - 1492
  • [5] Non-contacting seal
    Crane, J
    INTERNATIONAL GAS ENGINEERING AND MANAGEMENT, 2001, 41 (08): : 31 - 31
  • [6] A new non-contacting non-destructive testing method for defect detection in concrete
    Mori, K
    Spagnoli, A
    Murakami, Y
    Kondo, G
    Torigoe, I
    NDT & E INTERNATIONAL, 2002, 35 (06) : 399 - 406
  • [7] Impedance Vibration Detecting of Microstrip Line by Non-Contacting Magnetic Probing
    Wang, Tai-Chiuan
    Lan, Chiao-Han
    Ou, Chun-Ren
    Wu, Sung-Mao
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 412 - 417
  • [8] Preparation of nickel by non-contacting smelting reduction method
    Sun, Chang-Yu
    Guo, Xing-Min
    Li, Fei
    Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2010, 20 (10): : 2045 - 2050
  • [9] Non-contacting angular position
    不详
    AIRCRAFT ENGINEERING AND AEROSPACE TECHNOLOGY, 2002, 74 (05): : 478 - 479
  • [10] Detecting Defects on Planar Circuits by Using Non-Contacting Magnetic Probe
    Wu, Sung-Mao
    Wang, Tai-Chiuan
    Lan, Chiao-Han
    2010 ASIA-PACIFIC MICROWAVE CONFERENCE, 2010, : 1440 - 1443
12345