SIMULATION AND DESIGN OF LOSSY TRANSMISSION-LINES IN A THIN-FILM MULTICHIP PACKAGE

被引：8
作者：
NAYAK, D
HWANG, LT
TURLIK, I
机构：
[1] MICROELECTR CTR N CAROLINA,DIV ADV PACKAGING,RES TRIANGLE PK,NC 27709
[2] MICROELECTR CTR N CAROLINA,ADV PACKAGING TECHNOL PROGRAM,RES TRIANGLE PK,NC 27709
[3] BELL NO RES,EXPLORATORY PROC,RES TRIANGLE PK,NC
来源：
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY | 1990年 / 13卷 / 02期
关键词：
D O I：
10.1109/33.56160
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
A thin-film multichip package design was evaluated for its applications in packaging high performance VLSI/ULSI chips. Typical thin-film interconnections (copper lines 8 µm wide and 4 µ m thick) were analyzed, and a large CMOS driver was employed in the simulation. It was found that a pitch of 32 µ m for the microstrip configuration, and 20 µ m for the stripline configuration is required to obtain a low crosstalk environment for an input frequency up to 1 GHz. It is shown that long lines (length between 8 cm and 18 cm) do not need any termination, but short lines (shorter than 8 cm, but longer than the length at which a line is considered to be a lumped circuit) must be terminated with customized termination resistors to obtain optimal package performance. The loading effects on the termination behavior of short and long thin-film microstrips were also discussed. Finally, it is shown that high power generation in thin-film lines at a high frequency (1 GHz) would require an advanced cooling technique for the thin-film multichip package. © 1990 IEEE
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页码：294 / 302
页数：9
相关论文
共 25 条
[1]  
BARTLETT CJ, 1987, 37TH P EL COMP C, P518
[2]  
CHAO CC, 1988, 38TH P EL COMP C LOS, P276
[3]  
DARVEAUX R, COMMUNICATION
[4]  
Deutsch A., 1983, Proceedings IEEE International Conference on Computer Design: VLSI in Computers (ICCD '83), P222
[5]  
DEUTSCH A, 1981, P IEEE INT S CIRCUIT, P1
[6]  
DISHON G, COMMUNICATION
[7]   TIME-DOMAIN RESPONSE OF MULTICONDUCTOR TRANSMISSION-LINES [J].
DJORDJEVIC, AR ;
SARKAR, TK ;
HARRINGTON, RF .
PROCEEDINGS OF THE IEEE, 1987, 75 (06) :743-764
[8]  
ERDMAN DJ, 1987, CAZM USERS GUIDE
[9]  
GOODMAN LS, 1983, SOLID STATE TECHNOL, P91
[10]  
HAGGE JK, 1988, 38TH P EL COMP C LOS, P282
123