SOLDER REFLOW FOR SMT

被引：0
|
作者：
HUTCHINS, CL
机构：
来源：
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES | 1989年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：433 / 438
页数：6
相关论文
共 50 条
  • [41] Research on SMT Solder Joint Image Segmentation
    Sun Yaqi
    Liu Yu
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 1288 - 1290
  • [42] Strip plating with in-line solder reflow
    Thede, Mark
    Stewart, Douglas R.
    Metal Finishing, 2002, 100 (05) : 37 - 38
  • [43] SOLDER INTERCONNECTIONS FOR SMT SELECTIVE LINE COUPLING
    PARLA, A
    PROCOPIO, G
    POSIVY, JK
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04): : 738 - 743
  • [44] Reflow of AuSn solder creates strong joints
    Golosker, I. (golosker1ia@lnl.gov), 1600, American Welding Society (92):
  • [45] Reflow of AuSn Solder Creates Strong Joints
    Golosker, Ilya
    Florando, Jeffrey
    WELDING JOURNAL, 2013, 92 (02) : 48 - 53
  • [46] SOLDER BUMP REFLOW TAPE AUTOMATED BONDING
    SPEERSCHNEIDER, CJ
    LEE, JM
    MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES, 1989, : 7 - 12
  • [47] Hi-rel SMT solder joints
    Engelmaier, Werner
    Circuits manufacturing, 1988, 28 (12):
  • [48] Magnitude and location of strain in SMT solder joints
    Grossmann, G
    Affolter, C
    MICRO MATERIALS, PROCEEDINGS, 2000, : 448 - 451
  • [49] Experimental studies of SMT solder joint reliability
    Leung, KM
    DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 337 - 342
  • [50] Effect of Solder Ball Geometry on Solder Joint Reliability under Solder Reflow Cooling Process
    Ming, Lau Hong
    Debnath, Sujan
    Johar, Mahzan
    Asasaari, Siti Faizah Mad
    Januddi, Mohd Al Fatihhi Szali
    Kosnan, Mohamad Shahrul Effendy
    INTERNATIONAL JOURNAL OF ONLINE AND BIOMEDICAL ENGINEERING, 2022, 18 (08) : 142 - 153
12345