SOLDER REFLOW FOR SMT

被引：0
|
作者：
HUTCHINS, CL
机构：
来源：
MICROELECTRONIC PACKAGING TECHNOLOGY: MATERIALS AND PROCESSES | 1989年
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D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
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页码：433 / 438
页数：6
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