ADHESION STUDIES OF CU-CR ALLOYS ON AL2O3

被引：9
|
作者：
CHAN, CJ
CHANG, CA
FARRELL, CE
SCHROTT, AG
机构：
[1] IBM Research Division, T. J. Watson Research Center, Yorktown Heights
来源：
APPLIED PHYSICS LETTERS | 1993年 / 62卷 / 06期
关键词：
D O I：
10.1063/1.108888
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
Adhesion of Cu-Cr alloys to c-axis sapphire wafers has been studied. A large increase in peel strength was observed when the Cr content exceeded 15 at. % for the as-deposited alloy films. The high measured peel strength can be attributed to Cr that segregates to the sapphire-alloy interface due to its high free energy in the metastable alloy structure. Heat treatment was found to greatly enhance the adhesion of low Cr containing (15 at. %) Cu-Cr alloys to c-axis sapphire. Cr was found to segregate to the sapphire-alloy interface or separate as spherical precipitates in the Cu matrix upon appropriate thermal treatment. Increase in peel strength between sapphire and the low Cr alloy interface was observed at annealing temperatures as low as 200-degrees-C.
引用
收藏
页码：654 / 656
页数：3
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