ANODIC BEHAVIOR OF COPPER IN WEAKLY ALKALINE-SOLUTIONS

被引:58
作者
TROMANS, D
SUN, RH
机构
[1] Department of Metals and Materials Engineering, The University of British Columbia, Vancouver, BC
关键词
D O I
10.1149/1.2069527
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The anodic polarization behavior of copper was studied in the pH range 9.4 to 10.8, where pH was controlled (buffered) by additions of either borate, bicarbonate/carbonate, ammonia, or sodium hydroxide. Several solutions contained either IM sulfate, 1M chloride, or 5M chloride. Passivation effects were observed in all solutions, except those containing 5M chloride, and were accompanied by two anodic current peaks involving formation of Cu2O films and films containing Cu(OH)2 and CuO. Passivity breakdown occurred when the Cu(II) state was present in the film and occurred over a potential range whose highest and lowest values differed by approximately 0.7 V. The prime factor controlling the breakdown potential was the concentration of the buf fer species, independent of the type of buf fer, and not the pH of the bulk solution. It was concluded from the results and subsequent discussion that film breakdown was determined primarily by the loss of pH control at the electrode surface, due to the generation of protons accompanying film growth. A simple mass-transfer model defined the general relationship between buffer concentration, anodic passive current density, and loss of pH control. Secondary factors contributing to film breakdown, such as the formation of soluble complexes, were also considered.
引用
收藏
页码:1945 / 1951
页数:7
相关论文
共 22 条
[1]   ANODIC DISSOLUTION OF COPPER IN FLOWING SODIUM-CHLORIDE SOLUTIONS BETWEEN 25 DEGREES AND 175 DEGREES C [J].
BACARELLA, AL ;
GRIESS, JC .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1973, 120 (04) :459-465
[2]  
Bard A. J, 1985, STANDARD POTENTIALS
[3]  
Bertocci U., 1985, STANDARD POTENTIALS, P287
[4]   THE MECHANISM OF OXIDATION OF COPPER IN ALKALINE-SOLUTIONS [J].
DECHIALVO, MRG ;
MARCHIANO, SL ;
ARVIA, AJ .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1984, 14 (02) :165-175
[5]   CHARACTERIZATION OF OXIDE LAYERS ON COPPER BY LINEAR POTENTIAL SWEEP VOLTAMMETRY [J].
DEUTSCHER, RL ;
WOODS, R .
JOURNAL OF APPLIED ELECTROCHEMISTRY, 1986, 16 (03) :413-421
[6]   TRANSPORT PROCESSES IN PASSIVITY BREAKDOWN .2. FULL HYDROLYSIS OF THE METAL-IONS [J].
GALVELE, JR .
CORROSION SCIENCE, 1981, 21 (08) :551-579
[7]   XPS STUDIES OF ANODIC SURFACE-FILMS ON COPPER ELECTRODES [J].
KAUTEK, W ;
GORDON, JG .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1990, 137 (09) :2672-2677
[8]   KINETICS AND MECHANISMS OF CU-ELECTRODISSOLUTION IN CHLORIDE MEDIA [J].
LEE, HP ;
NOBE, K .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (10) :2035-2043
[9]   FILM FORMATION AND CURRENT OSCILLATIONS IN THE ELECTRODISSOLUTION OF CU IN ACIDIC CHLORIDE MEDIA .1. EXPERIMENTAL STUDIES [J].
LEE, HP ;
NOBE, K ;
PEARLSTEIN, AJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1985, 132 (05) :1031-1037
[10]   GROWTH, CORROSION AND CAPACITY OF COPPER-OXIDE FILMS INVESTIGATED BY PULSE TECHNIQUES [J].
LOHRENGEL, MM ;
SCHULTZE, JW ;
SPECKMANN, HD ;
STREHBLOW, HH .
ELECTROCHIMICA ACTA, 1987, 32 (05) :733-742