THE RELATIONSHIP OF THE SILICON SURFACE-ROUGHNESS AND GATE OXIDE INTEGRITY IN NH4OH/H2O2 MIXTURES

In this study some recent findings on the cleaning action of the NH4OH/H2O2 (SC1) step in a pre-gate oxidation cleaning (RCA cleaning) are given. An important parameter in this mixture is the NH4OH/H2O2 ratio. The Fe contamination on the silicon surface after this cleaning step is found to increase upon decreasing the NH4OH/H2O2 ratio. This can be attributed to the incorporation of Fe in the chemical oxide, grown by the hydrogen peroxide. The particle removal efficiency of the cleaning step is found to decrease upon decreasing the NH4OH/H2O2 ratio. On the other hand, using a lower NH4OH concentration results in a less severe silicon surface roughening. It is demonstrated in this study that the NH4OH/H2O2 ratio during the SC1 step of the cleaning is the determining parameter for the breakdown properties of a gate oxide. A (0.25/1/5) NH4OH/H2O2/H2O mixture at 75-degrees-C in our experimental conditions is suggested to be the best compromise between particle removal and surface roughness during the SC1 step.