共 50 条
- [22] ULTRASONIC BONDING OF INTEGRATED CIRCUITS TO THICK FILM PEDESTALS ON CERAMIC SUBSTRATES PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1969, : 254 - +
- [23] THICK-FILM NICKEL METALLIZATION FOR ELECTRONIC CIRCUITS AMERICAN CERAMIC SOCIETY BULLETIN, 1977, 56 (03): : 326 - 326
- [24] REVERSE PHOTOLITHOGRAPHIC TECHNIQUE FOR THICK-FILM CIRCUITS MICROELECTRONICS AND RELIABILITY, 1985, 25 (01): : 61 - 63
- [28] PRECISION ETCHING OF THICK-FILM ALUMINUM CIRCUITS PLATING AND SURFACE FINISHING, 1979, 66 (04): : 52 - 56
- [30] PROGRESS IN MAKING TIN AND THICK-FILM CIRCUITS ELECTRONIC ENGINEERING, 1969, 41 (495): : 57 - &