ORIGINS OF STRESS IN THIN NICKEL FILMS

被引:185
作者
DOLJACK, FA
HOFFMAN, RW
机构
关键词
D O I
10.1016/0040-6090(72)90396-3
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
引用
收藏
页码:71 / &
相关论文
共 5 条
[1]  
DOLJACK FA, TO BE PUBLISHED
[2]  
FINEGAN JD, 1961, AEC18 TECH REP
[3]   DIFFUSIVITY AND SOLUBILITY OF SI IN AL METALLIZATION OF INTEGRATED CIRCUITS [J].
MCCALDIN, JO ;
SANKUR, H .
APPLIED PHYSICS LETTERS, 1971, 19 (12) :524-&
[4]   LOW TEMPERATURE DIFFUSION IN POLYCRYSTALLINE THIN-FILM GOLD-NICKEL COUPLES [J].
RICHARDS, JL ;
MCCANN, WH .
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1969, 6 (04) :644-&
[5]   INTERDIFFUSION IN CU-NI, CO-NI, AND CO-CU [J].
TRONSDAL, GO ;
SORUM, H .
PHYSICA STATUS SOLIDI, 1964, 4 (03) :493-498